Extel Communications - Innovative Access Solutions
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Company Overview
The Extel Vision
Capabilities

Capabilities

Quality Policy

Extel Communications aims to exceed our customers' expectations by
continually improving the quality of our employees, processes, products and service.

We believe that quality does not happen by accident but is the result of teamwork and intelligent thinking. The Extel team is extended to include customers and suppliers.

Every employee is expected to take responsibility for their role to implement quality improvements at all levels within our company and to strive to work together with our customers and suppliers to provide quality, cost effective and timely solutions.

Environmental Policy

Extel Communications is committed to environmental responsibility and has established a formal Environmental Management System to ensure it manufactures and supplies products in an environmental friendly manner. This commitment includes working with customers and suppliers to minimise the environmental impact of our products throughout their entire lifecycle. We also design our products and processes to limit the use of toxins and promote the use of recyclable materials.

Extel will continue to set itself challenging environmental goals. Extel believes environmental management is a key contributor to customer and shareholder value and aims to consistently excel in this area.

Manufacturing Capability

Extel Manufacturing EquipmentExtel Communications has a successful history of developing and manufacturing innovative telecommunications access products. The company has continually upgraded its state-of-the-art manufacturing facility to improve quality, efficiency and cost competitiveness. Rigorous functional testing guarantees product quality.

Extel's manufacturing capabilities include:

. Lead-Free Manufacturing and Leaded Manufacturing
· Multi-layer printed circuit board assembly using convection and   vapour phase technologies
· Surface mount assembly capability:
  - 22,800 components per hour
  - 0.4 mm Ball Grid Array (BGA)
  - 0.4 mm Fine Pitch Component (FPC)
· Through Hole Assembly, Mechanical Assembly and Cable Assembly

Extel Hardware Testing· Computer controlled functional   testing

Extel also provides contract manufacturing services to external customers. For further information please contact us at: manufacturing@extelcomms.com


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